Nuevos Productos de interfaz térmica
Bourns BTJ Thermal Jumper Chips are unique surface-mount components that provide high thermal conductivity while maintaining insulating properties. These jumper chips are designed for thermal conductivity and dissipation in a variety of mobile devices and electronic equipment. The BTJ jumper chips feature high insulation resistance, low capacitance, and operate at -55°C to 155°C temperature range. These jumper chips can simplify complex thermal design and reduce the temperature rise of key devices, thereby improving system-level reliability. Typical applications include power supplies, switching power supplies, converters, amplifiers/RF, GaN, various ECUs, pin and laser diodes, and data servers.
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Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.02-02-2026
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Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.06-11-2025 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.15-09-2025 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.09-09-2025 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.25-08-2025 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.25-10-2024 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10-09-2024 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10-09-2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30-05-2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27-05-2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.18-01-2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.30-10-2023 -
LeaderTech Almohadillas térmicas de fibra de carbono ultrafinas TCFBaja resistencia térmica, superficie blanda y utilizan principalmente fibra de carbono como relleno conductivo térmico.18-10-2023 -
LeaderTech Almohadillas térmicas ultrafinas TGNOfrecen baja resistencia térmica y combinan grafeno y silicona en su fabricación.18-10-2023 -
LeaderTech Lámina de compuestos de indio TCITransiciones de sólido a líquido en su punto de fusión y de vuelta a sólido nuevamente a temperatura ambiente.18-10-2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27-09-2023 -
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal GreaseHigh-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.13-09-2023 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.08-09-2023 -
Bergquist Company Aplicaciones de centros de datosMateriales avanzados que contribuyen a la gestión térmica, la confiabilidad a largo plazo y la protección contra el estrés.01-04-2023 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.03-08-2022 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.03-08-2022 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.19-07-2022 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.11-07-2022 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.03-06-2022 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.13-04-2022