NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

Resultados: 34
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Descripción Hoja de datos Disponibilidad Precio: (CLP) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Régimen de corriente
Régimen de voltaje
Velocidad de transmisión de datos máxima
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Revestimiento del contacto
Material del contacto
Material del alojamiento
Velocidad de transmisión de datos
Serie
Empaquetado

Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Plug Solder Balls
Hoja de datos
20En existencias
$72.583
$70.168
$66.306
Ver
Min.: 20
Mult.: 20
Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept Solder Balls
Hoja de datos
20En existencias
$65.622
$63.423
$59.937
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept 380 Solder Balls
Hoja de datos
Plazo de entrega no en existencias 26 Semanas
$139.880
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$20.860
$19.858
$19.197
$18.137
Ver
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept 380 Solder Balls
Hoja de datos
Plazo de entrega no en existencias 26 Semanas
$131.347
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$39.328
$38.063
$36.787
$34.771
Ver
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$52.224
$50.481
$47.713
$47.701
Ver
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept 380 Solder Balls
Hoja de datos
No en existencias
$47.200
$45.674
$44.147
$41.720
Ver
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$27.081
$25.782
$24.916
$23.537
Ver
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept 380 Solder Balls
Hoja de datos
No en existencias
$49.160
$47.576
$45.993
$43.452
Presupuesto
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$49.160
$47.576
$45.993
$43.452
Presupuesto
Min.: 24
Mult.: 24
Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept 570 Solder Balls
Hoja de datos
No en existencias
$52.851
$51.085
$48.271
$48.260
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$55.631
$53.774
$50.823
$50.812
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept 570 Solder Balls
Hoja de datos
No en existencias
$68.482
$66.192
$62.569
Ver
Min.: 40
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$57.055
$55.152
$52.122
$52.110
Presupuesto
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 13 mm, 15 mm, 17 mm, 20 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept 570 Solder Balls
Hoja de datos
No en existencias
$62.341
$60.256
$56.941
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 18 mm, 20 mm, 22 mm, 25 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept 570 Solder Balls
Hoja de datos
No en existencias
$68.470
$66.181
$62.558
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$68.470
$66.181
$62.558
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 23 mm, 25 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept 570 Solder Balls
Hoja de datos
No en existencias
$71.319
$68.938
$65.155
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 300P NeXLev Recept Solder Balls
Hoja de datos
No en existencias
$88.157
$85.206
$80.547
Ver
Min.: 20
Mult.: 20
Receptacles 300 Position 1.15 mm (0.045 in) BGA Vertical 26 mm, 28 mm, 30 mm, 33 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 12.5 Gbps NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Plug 380 Solder Balls
Hoja de datos
No en existencias
$111.854
$105.702
Ver
Min.: 96
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Plug Solder Balls
Hoja de datos
No en existencias
$34.509
$33.392
$32.276
$30.498
Ver
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Plug 380 Solder Balls
Hoja de datos
No en existencias
$30.567
$29.587
$28.596
$27.012
Ver
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Plug Solder Balls
Hoja de datos
No en existencias
$56.087
$54.218
$51.233
$51.222
Presupuesto
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS Conectores placa a placa y Mezzanine 200P NeXLev Plug 380 Solder Balls
Hoja de datos
No en existencias
$33.016
$31.945
$30.886
$29.177
Ver
Min.: 24
Mult.: 24
Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev