Bergquist Company Server Applications
Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.
Thermal Management Materials
Thermal GAP PAD® Materials
GAP PAD Family Microsite
TGP HC3000 Series, 3W/m-K, High Compliance Soft
TGP HC5000 Series, 5W/m-K, Highly Conformable Soft
TGP 3000ULM Series, 3W/m-K, Extremely Soft
TGP 3500ULM Series, 3.5W/m-K, Extremely Soft
TGP 6000ULM Series, 6W/m-K, Extremely Soft
TGP 7000ULM Series, 7W/m-K, Extremely Soft
TGP 10000ULM Series, 10W/m-K, Extremely Soft
TGP 12000ULM Series, 12W/m-K, Extremely Soft
Thermal Phase Change Materials
Hi-Flow THF 1600G Series, 1.6W/m-K
Hi-Flow THF 5000UT Series, 5.3W/m-K
Related Applications
Bergquist Company Aplicaciones de centros de datos
Materiales avanzados que contribuyen a la gestión térmica, la confiabilidad a largo plazo y la protección contra el estrés.
Bergquist Company Aplicaciones para enrutadores, conmutadores y redes
Materiales y adhesivos diseñados para disipar el calor en componentes con sensibilidad térmica.
Bergquist Company Aplicaciones de almacenamiento
Materiales avanzados para hardware de almacenamiento que aumentan la confiabilidad, la estabilidad y las velocidades de transferencia.
Loctite Aplicaciones de servidores
Productos de gestión térmica diseñados para una amplia gama de usos, independientemente de la cantidad de servidores que se utilicen.
Featured Products
Bergquist Company GAP PAD® Thermally Conductive Materials
Interface materials with greater conformability, higher thermal performance, and easier application.
Bergquist Company TGP HC5000 Highly Conformable GAP PAD®
Silicon-based 5.0 W/m-K high compliance GAP PAD is non-electrically conductive & highly conformable
Bergquist Company TGP 6000ULM 6W/m-K, High Performance GAP PAD®
Soft gap-filling materials with 6W/m·K thermal conductivity for high-performance applications.
Bergquist Company TGP 7000ULM 7W/m-K, Extremely Soft GAP PAD®
Soft gap-filling materials with 7W/m·K thermal conductivity for high-performance applications.
Bergquist Company TGP 10000ULM 10W/m-K Extremely Soft GAP PAD®
UL94V-0 flammability rating, 10W/m-K thermal conductivity, and -60°C to +200°C temperature range.
Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD®
High thermal conductivity and ultra-low modulus TIM for use in modern datacom applications.
Bergquist Company Liqui-Form TLF 3800LVO Liquid Formable Gel
Offers low volatility, low assembly stress, and high thermal conductivity for high reliability.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.