Infineon Technologies 650V 3-level IGBT Modules
Infineon Technologies 650V 3-level IGBT Modules are EasyPACK™ modules with Trench/Fieldstop technology. These modules feature low inductive design, low switching losses, and low VCE(sat). The IGBT modules provide Al2O3 substrate with low thermal resistance, compact design, PressFIT contact technology, and rugged mounting due to integrated mounting clamps. Potential applications include three-level applications, motor drives, solar applications, and UPS systems in EasyPACK™ modules.
Features
- Mechanical:
- Al2O3 substrate with low thermal resistance
- Compact design
- PressFIT contact technology
- Rugged mounting due to integrated mounting clamps
- Electrical:
- Low inductive design
- Low switching losses
- Low VCE(sat)
Specifications
- F3L150R07W2H3_B11 & DF300R07W2H3_B77:
- IC(nom) = 150A
- ICRM = 300A
- F3L100R07W2H3_B11 & DF200R07W2H3_B77:
- IC(nom) = 100A
- ICRM = 200A
- 650V VCES
- Up to 650V increased blocking voltage capability
- -40°C to 125°C storage temperature range (Tstg)
- 40N to 80N mounting force per clamp
- 39g weight
Applications
- Three-level applications
- Motor drives
- Solar applications
- UPS systems
Schematic Diagrams
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View Results ( 4 ) Page
| N.º de artículo | Hoja de datos | Empaquetado | Cantidad de Paquete Estándar |
|---|---|---|---|
| DF200R07W2H3B77BPSA1 |  |
Tray | 15 |
| F3L100R07W2H3B11BPSA1 | |
Tray | 15 |
| F3L150R07W2H3B11BPSA1 | |
Tray | 15 |
| DF300R07W2H3B77BPSA1 | |
Tray | 15 |
Publicado: 2022-02-16
| Actualizado: 2024-07-26