+ 105 C DRAM

Results: 210
Select Image Part # Mfr. Description Datasheet Availability Pricing (CLP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Memory Size Data Bus Width Maximum Clock Frequency Package / Case Organization Access Time Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Series Packaging
Alliance Memory DRAM DDR3, 4G, 256M X 16, 1.35V, 96-BALL FBGA, 800MHZ, Automotive Temp - Tray
645On Order
Min.: 1
Mult.: 1

SDRAM - DDR3L 4 Gbit 16 bit 800 MHz FBGA-96 256 M x 16 20 ns 1.283 V 1.45 V - 40 C + 105 C Tray
ISSI IS46LQ32256A-062BLA2
ISSI DRAM Automotive (Tc: -40 to +105C), 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS
408On Order
Min.: 1
Mult.: 1

SDRAM Mobile - LPDDR4 8 Gbit 32 bit 1.6 GHz BGA-200 256 M x 32 1.06 V 1.95 V - 40 C + 105 C
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS
190On Order
Min.: 1
Mult.: 1

SDRAM 128 Mbit 32 bit 166 MHz BGA-90 4 M x 32 6 ns 3 V 3.6 V - 40 C + 105 C IS45S32400F Tray
ISSI DRAM Automotive (-40 to +105C), 256M, 3.3V, SDRAM, 16Mx16, 143MHz, 54 pin TSOP II RoHS
972On Order
Min.: 1
Mult.: 1

SDRAM 256 Mbit 16 bit 143 MHz TSOP-II-54 16 M x 16 5.4 ns 3 V 3.6 V - 40 C + 105 C IS45S16160J
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 8Mx16, 143Mhz, 54 ball BGA (8mmx8mm) ROHS
1.216On Order
Min.: 1
Mult.: 1

SDRAM 128 Mbit 16 bit 143 MHz BGA-54 8 M x 16 5.4 ns 3 V 3.6 V - 40 C + 105 C
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 86 pin TSOP II (400 mil) RoHS
972On Order
Min.: 1
Mult.: 1

SDRAM 128 Mbit 32 bit 166 MHz TSOP-II-86 4 M x 32 5.4 ns 3 V 3.6 V - 40 C + 105 C
Alliance Memory DRAM DDR2, 2G, 128M x 16, 1.8V, 400 Mhz, 84ball FBGA, (A-die), Automotive Temp - Tray
209Expected 9/21/2026
Min.: 1
Mult.: 1

SDRAM - DDR2 2 Gbit 16 bit 400 MHz FBGA-84 128 M x 16 400 ps 1.7 V 1.9 V - 40 C + 105 C AS4C128M16D2A-25 Tray
Alliance Memory DRAM SDRAM, 256Mb, 16M x 16, 3.3V, 54pin TSOP II, 166 Mhz, automotive temp - Tray
212Expected 8/10/2026
Min.: 1
Mult.: 1

SDRAM 256 Mbit 16 bit 166 MHz TSOP-II-54 16 M x 16 5 ns 3 V 3.6 V - 40 C + 105 C Tray
Alliance Memory DRAM SDRAM, 64Mb, 4M x 16, 3.3V, 54pin TSOP II, 166 Mhz, Automotive temp - Tray
432On Order
Min.: 1
Mult.: 1

SDRAM 64 Mbit 16 bit 166 MHz TSOP-II-54 4 M x 16 5.4 ns 3 V 3.6 V - 40 C + 105 C AS4C4M16SA Tray
Alliance Memory DRAM DDR3, 1G, 64M x 16, 1.5V, 96-ball FBGA, 800MHz, (B-die), Automotive Temp - Tray
190Expected 12/15/2026
Min.: 1
Mult.: 1

SDRAM - DDR3 1 Gbit 16 bit 800 MHz FBGA-96 64 M x 16 20 ns 1.425 V 1.575 V - 40 C + 105 C AS4C64M16D3B Tray
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS
239Expected 8/3/2027
Min.: 1
Mult.: 1

SDRAM 128 Mbit 32 bit 166 MHz TSOP-II-86 4 M x 32 5.4 ns 3 V 3.6 V - 40 C + 105 C
ISSI DRAM Automotive (-40 to +105C), 64M, 3.3V, SDRAM, 2Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

SDRAM 64 Mbit 32 bit 143 MHz BGA-90 2 M x 32 5.4 ns 3 V 3.66 V - 40 C + 105 C
SMART Modular Technologies DRAM LPDDR4 16Gb 51 2Mx32 1.1V 4267Mbps 200-ball BGA Ind Distributed-Sold by SMART Non-Stocked Lead-Time 13 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

SDRAM - LPDDR4 16 Gbit FBGA-200 512 M x 32 3.5 ns 1.1 V 1.8 V - 40 C + 105 C Reel
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 Mbit 200 MHz FBGA-24 35 ns 1.7 V 2 V - 40 C + 105 C Tray
AP Memory DRAM IoT RAM 64Mb OPI (x8) DDR 200MHz, 1.8V, Ext. Temp., BGA24 Lead-Time 20 Weeks
Min.: 1
Mult.: 1

PSRAM (Pseudo SRAM) 64 Mbit 8 bit 200 MHz BGA-24 8 M x 8 1.62 V 1.98 V - 40 C + 105 C IoT RAM Tray
Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Tray
Infineon Technologies S80KS2564GACHB043
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

HyperRAM 256 Mbit 16 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Reel
Infineon Technologies S80KS2562GABHV020
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 256 Mbit 8 bit 200 MHz FBGA-24 32 M x 8 35 ns 1.7 V 2 V - 40 C + 105 C Tray
Infineon Technologies S27KL0643GABHV020
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 3.380
Mult.: 3.380

HyperRAM 64 Mbit 8 bit 200 MHz 8 M x 8 35 ns 2.7 V 3.6 V - 40 C + 105 C Tray
Infineon Technologies S70KL1283DPBHV020
Infineon Technologies DRAM SPCM Lead-Time 26 Weeks
Min.: 1
Mult.: 1

HyperRAM 128 Mbit 8 bit 166 MHz 16 M x 8 36 ns 2.7 V 3.6 V - 40 C + 105 C Tray
AP Memory APS256XXN-OBX9-BG
AP Memory DRAM IoT RAM 256Mb OPI (x8,x16) DDR 250MHz, 1.8V, Ext.. Temp., BGA24 Non-Stocked Lead-Time 20 Weeks
Min.: 4.800
Mult.: 4.800

PSRAM (Pseudo SRAM) 256 Mbit 8 bit / 16 bit 250 MHz BGA-24 32 M x 8/16 M x 16 1.62 V 1.98 V - 40 C + 105 C IoT RAM Tray
ISSI DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

SDRAM 64 Mbit 32 bit 143 MHz BGA-90 2 M x 32 5.5 ns 3 V 3.6 V - 40 C + 105 C IS45S32200L Tray
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 A-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SDRAM - DDR3L 1 Gbit 16 bit 800 MHz FBGA-96 64 M x 16 20 ns 1.283 V 1.45 V - 40 C + 105 C AS4C64M16D3LB Reel
Zentel Japan DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C Non-Stocked Lead-Time 20 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 512 Mbit 16 bit 400 MHz FPGA-84 32 M x 16 400 ps 1.7 V 1.9 V - 40 C + 105 C DDR2 Tray
Zentel Japan DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C Non-Stocked Lead-Time 20 Weeks
Min.: 2.000
Mult.: 2.000

SDRAM - DDR2 1 Gbit 16 bit 400 MHz FPGA-84 64 M x 16 400 ps 1.7 V 1.9 V - 40 C + 105 C DDR2 Tray