Minitek® Pwr 3.0 Higher Current Connectors

Amphenol FCI Minitek® Pwr 3.0 Higher Current Connectors (HCC) are designed for power-dense applications with current ratings up to 12.5A per contact. This connector series is available in a dual-row configuration with 2 to 24 circuits and is designed for Wire-to-Wire, Wire-to-Board, and Wire-to-Panel applications. Crimp, snap-in header, and receptacle contacts are used to terminate 20AWG to 16AWG wires.

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Results: 83
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Description Datasheet Availability Pricing (CLP) Filter the results in the table by unit price based on your quantity.
Qty. RoHS
Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 04 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
250Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 06 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
200Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 10 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
140Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
130Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
110On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
100Expected 8/18/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
90On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, R/A Through Hole Header, 80" Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80On Order
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 12 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
150Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
130Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
120Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
110Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
100Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
90Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Pwr HCC 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 24 Positions, Black Color, LCP, GW Compatible, Tray packing
Datasheet
80Expected 8/17/2026
Min.: 1
Mult.: 1

Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 14Pos
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.000
Mult.: 6.000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 18Pos
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.000
Mult.: 6.000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 20Pos
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.000
Mult.: 6.000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 22Pos
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.000
Mult.: 6.000
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR V Rec Hsg 24Pos
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.000
Mult.: 500
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos G/F
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 9.842
Mult.: 9.842
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 2Pos Tin
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 4Pos G/F
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 6.188
Mult.: 6.188
Amphenol FCI Power to the Board Minitek Power3.0 HCC DR RATH HDR 6Pos G/F
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 4.522
Mult.: 4.522