Samtec LPAM Serie Conectores placa a placa y Mezzanine

Resultados: 116
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Descripción Hoja de datos Disponibilidad Precio: (CLP) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Régimen de corriente
Régimen de voltaje
Velocidad de transmisión de datos máxima
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Revestimiento del contacto
Material del contacto
Material del alojamiento
Serie
Empaquetado
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
325En existencias
Min.: 1
Mult.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
385En existencias
Min.: 1
Mult.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec LPAM-30-01.0-S-06-1-K-TR
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
275En existencias
Min.: 1
Mult.: 1
: 325
LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
633En existencias
Min.: 1
Mult.: 1
: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
162En existencias
Min.: 1
Mult.: 1
: 325

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
175En existencias
Min.: 1
Mult.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
232En existencias
Min.: 1
Mult.: 1
: 300

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
186En existencias
Min.: 1
Mult.: 1
: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
168En existencias
Min.: 1
Mult.: 1
: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
191En existencias
Min.: 1
Mult.: 1
: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
255En existencias
Min.: 1
Mult.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
454En existencias
Min.: 1
Mult.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
332En existencias
Min.: 1
Mult.: 1
: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
306En existencias
Min.: 1
Mult.: 1
: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
607En existencias
Min.: 1
Mult.: 1
: 300

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
120En existencias
Min.: 1
Mult.: 1
: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
2En existencias
Min.: 1
Mult.: 1
: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
353En existencias
Min.: 1
Mult.: 1
: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
18En existencias
Min.: 1
Mult.: 1
: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
43En existencias
300Se espera el 27-07-2026
Min.: 1
Mult.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
150En existencias
Min.: 1
Mult.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
251En existencias
Min.: 1
Mult.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
18En existencias
Min.: 1
Mult.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
Plazo de entrega no en existencias 4 Semanas
Min.: 625
Mult.: 625
: 625
LPAM Reel
Samtec Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
Plazo de entrega no en existencias 3 Semanas
Min.: 625
Mult.: 625
: 625

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel