UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Results: 40
Select Image Part # Mfr. Description Datasheet Availability Pricing (CLP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 9/14/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 9/7/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 10/12/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22Expected 11/9/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 9/21/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/7/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/19/2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Expected 10/20/2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Expected 9/14/2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Board to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket Non-Stocked Lead-Time 10 Weeks
Min.: 350
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6