Computadora en un Módulo (COM) COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Computadora en un Módulo (COM) COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Enfriadores de chips y CPU COMe Active Uni Cooler (w/o HSP)

Tableros y Juegos de Desarrollo - ARM SMARC Evaluation Carrier 2.0

Tableros y Juegos de Desarrollo - x86 COMe Eval Carrier T7

Computadora en un Módulo (COM) COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 1.4Ghz up to 4.8GHz (turbo) E-Cores 0.9GHz up to 3.8GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra

Enfriadores de chips y CPU Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

Cuerpo de Refrigeración HSP COMe-mAL10 E2 through

Cuerpo de Refrigeración HSP COMe-mAL10 E2 slim thread

Cuerpo de Refrigeración Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

Cuerpo de Refrigeración Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

Tableros y Juegos de Desarrollo - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0