L1GN50G253KA05

KEMET
80-L1GN50G253KA05
L1GN50G253KA05

Fabricante:

Descripción:
Capacitores cerámicos de capas múltiples (MLCC) - Emplomados 2000V 0.025uF C0G 10%
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Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
Mínimo: 25   Múltiples: 1
Precio unitario:
$-
Precio ext.:
$-
Est. Tarifa:

Precio (CLP)

Cantidad Precio unitario
Precio ext.
$53.721 $1.343.025
$52.034 $2.601.700
$50.449 $5.044.900
500 Presupuesto

Productos similares

Atributo del producto Valor de atributo Seleccionar atributo
KEMET
Categoría de producto: Capacitores cerámicos de capas múltiples (MLCC) - Emplomados
RoHS:  
KPS-MCC Indust
Radial
0.025 uF
2 kVDC
C0G (NP0)
10 %
11.43 mm
Conformally Coated
- 55 C
+ 200 C
Stacked MLCCs
6.35 mm
7.62 mm
2.54 mm
Waffle
Marca: KEMET
Factor de disipación DF: 0.1 %
Estilo de conector: Straight
Tipo de producto: Ceramic Capacitors
Cantidad de empaque de fábrica: 1
Subcategoría: Capacitors
Tipo: Low ESR
Productos encontrados:
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Atributos seleccionados: 0

Hoja de datos

KSIM

Models

Specification Sheets

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Códigos de cumplimiento
CNHTS:
8532249000
CAHTS:
8532240090
USHTS:
8532240060
JPHTS:
853224000
KRHTS:
8532240000
TARIC:
8532240000
MXHTS:
8532240400
BRHTS:
85322490
ECCN:
EAR99
Clasificaciones de origen
País de origen:
México
País de origen del ensamblaje:
No disponible
País de difusión:
No disponible
El país está sujeto a cambios en el momento del envío.

Power Conversion Solutions

KEMET Power Conversion Solutions includes products designed to meet the demand for higher efficiency and higher power density converters. With the adoption of wide bandgap semiconductors (WBG), resonant converters, and wireless charging, there is a growing need for capacitor solutions as an enabling technology. The increasing trends in power converters require capacitor solutions with low ESR, low inductance, high ripple current handling capability, capacitance stability, and high operating temperatures. By utilizing KEMET's base metal electrode (BME) technology and CaZrO3 dielectric materials, engineers now have access to capacitors that will help increase efficiencies, increase power densities, and drive more power.

Industrial High Temp ≥175°C SMD/Leaded Capacitors

KEMET Industrial High-Temperature (≥175°C) SMD and Leaded Capacitors offer solutions for harsh environment applications. With operating temperature ranges up to +260°C, these capacitors are designed to withstand applications where standard commercial and automotive grade capacitors are not suited. KEMET Industrial High-Temperature (≥175°C) SMD and Leaded Capacitors are available in EIA case sizes ranging from 0402 to 4540.

High-Voltage ≥500V Capacitors

KEMET High-Voltage ≥500V Capacitors are offered in a variety of form factors, case sizes, dielectrics, and capacitance values. These devices feature MLCC EIA case sizes from 0603 to 6560 and voltage ratings from 500VDC to 10,000VDC. KEMET High-Voltage Capacitors are ideal for commercial, automotive, and industrial applications.

High Temperature ≥150°C Capacitors

KEMET High Temperature (≥150°C) Capacitors are available in a wide variety of form factors, dielectrics, case sizes, and capacitance values for commercial, automotive, and industrial applications. These high-temperature ceramic solutions go up to +260°C. KEMET’s high-temperature platform includes surface-mount and leaded options, which can also have flex termination and high voltage features to provide a solution for every application type.

KPS-MCC High-Temperature SMPS Stacks (Industrial)

KEMET Military Case Code (KPS-MCC) High-Temperature SMPS Ceramic Stacked Capacitors combine a proprietary and robust C0G/NPO base metal electrode dielectric system with a durable lead frame technology, ideal for high-temperature and high-power SMPS applications. KPS-MCC capacitors withstand harsh industrial environments, such as down-hole oil exploration and automotive/avionics engine compartment circuitry. The series is constructed with large chip multilayer ceramic capacitors (MLCCs), horizontally stacked and secured to a lead frame termination system using a high melting point solder alloy. The lead frame isolates the MLCCs from the PCB while obtaining a parallel circuit configuration. Mechanical and thermal stress performance is improved by mechanically isolating the capacitors from the PCB, while the parallel circuit configuration allows for bulk capacitance in the same or smaller design footprint.

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