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BALF-SPI2-02D3

Name: STMicroelectronics BALF-SPI2-02D3
Brand: STMicroelectronics
SKU: 511-BALF-SPI2-02D3
Price: 459 CLP
Availability: InStock

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Mouser N.º:

511-BALF-SPI2-02D3

Fabricante N.º:

BALF-SPI2-02D3

Fabricante:

STMicroelectronics

Descripción:

Acondicionamiento de señales 50 ohms nominal input / conjugate match balun to S2-LP, 433 - 470 MHz with int

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Hoja de datos:

BALF-SPI2-02D3 Hoja de datos (PDF)

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En existencias: 8.073

Existencias:: 8.073 Se puede enviar inmediatamente

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Plazo de entrega de fábrica:: 13 Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.

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Mínimo: 1 Múltiples: 1

Precio unitario:

Precio ext.:

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Precio (CLP)

Cantidad	Precio unitario	Precio ext.
	$459	$459
	$421	$4.210
	$393	$9.825
	$382	$38.200
	$367	$91.750
	$356	$178.000
	$338	$338.000
Envase tipo carrete completo (pedir en múltiplos de 5000)
	$241	$1.205.000

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Atributo del producto	Valor de atributo	Seleccionar atributo
Fabricante:	STMicroelectronics
Categoría de producto:	Acondicionamiento de señales
RoHS:
Tipo de producto:	Signal Conditioning
Producto:	Baluns
Frecuencia:	433 MHz
Impedancia:	50 Ohms
Estilo de terminación:	SMD/SMT
Paquete / Cubierta:	Flip-Chip-6
Temperatura de trabajo mínima:	- 40 C
Temperatura de trabajo máxima:	+ 105 C
Serie:	BALF-SPI2-02D3
Empaquetado:	Reel
Empaquetado:	Cut Tape
Marca:	STMicroelectronics
Pérdida por inserción:	1.95 dB
Montaje:	Board Mount
Cantidad de empaque de fábrica:	5000
Subcategoría:	Filters
Tipo:	Ultra-Miniature
Peso de la unidad:	23 mg

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Atributos seleccionados: 0

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Hoja de datos

BALF-SPI2-02D3 Hoja de datos (PDF)

PCN

CNHTS:: 8504319000
USHTS:: 8542390090
ECCN:: EAR99

Wireless Connectivity Solutions

STMicroelectronics Wireless Connectivity Solutions are a portfolio of wireless technology products that feature specific communication ranges, power efficiencies, latencies, bandwidths, and networking topologies. These are important parameters defined by the many standard communication protocols available. With the growing importance of wireless sensor networks and Internet of Things-related devices, there is virtually no electronic system that doesn't require wireless connectivity. Typical uses are consumer to industrial applications like wearable devices, smart-buildings, home-automation, asset-tracking solutions, or medical devices. ST’s portfolio offers an extensive variety of RF solutions covering most of the key protocols and standards and proprietary radio solutions. This includes ultra-low-power RF transceivers, network processors ICs, and a comprehensive family of Wireless System-on-Chips, including pre-certified wireless modules to simplify quick adoption of those technologies. The ST wireless portfolio covers the widest range of connectivity technologies including sub-1GHz long-range networking devices (enabling LoRaWAN®, Sigfox, and Wireless M-Bus connectivity), 60GHz short-range millimeter-wave RF, Bluetooth® LE, 802-15-4, OpenThread, LTE Cat 1, and Narrowband IoT. To speed time to market, reference designs and RF modules are available as a complete development ecosystem and framework with software packages, tools, protocol stacks, example applications, evaluation boards, and quick-start tutorials. This represents an all-in-one solution for a smarter and more connected world with the most sustainable wireless technologies.

BALF-SPI2-02D3 Ultra-miniature Balun

STMicroelectronics BALF-SPI2-02D3 Ultra-miniature Balun integrates matching network and harmonics filter. This balun with matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-02D3 uses IPD technology on a non-conductive glass substrate, which optimizes the RF performance. The BALF-SPI2-02D3 balun features 50Ω nominal input, low insertion loss, low amplitude imbalance, low-phase imbalance, high-RF performance, RF BOM, and area reduction. The STMicroelectronics BALF-SPI2-02D3 Ultra-miniature Balun is ideal for 433MHz impedance-matched balun filters and is optimized for ST S2-LP sub-GHz RFIC.

Balun Transformers

STMicroelectronics Balun Transformers use ST's process of integrating high-quality RF passive components on a single glass substrate. In addition to balanced/unbalanced conversion, these baluns can incorporate a matching network in a footprint smaller than 1mm² for the complete function. The baluns are designed using STMicroelectronics Integrated Passive Device (IPD) technology on a non-conductive glass substrate to optimize RF performance. These baluns include companion chips to ST's transceivers, help significantly reduce RF complexity, and provide an optimized link budget. Balun transformers integrate three functions: impedance matching, 50Ω nominal impedance, and harmonic filter.