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LPAM-10-01.0-S-06-2-K-TR

Name: Samtec LPAM-10-01.0-S-06-2-K-TR
Brand: Samtec
SKU: 200-LPAM10010S062KTR
Price: 8390 CLP
Availability: OutOfStock

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Mouser N.º:

200-LPAM10010S062KTR

Fabricante N.º:

LPAM-10-01.0-S-06-2-K-TR

Fabricante:

Samtec

Descripción:

Conectores placa a placa y Mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Hoja de datos:

LPAM-10-01.0-S-06-2-K-TR Hoja de datos (PDF)

Modelo ECAD:

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Disponibilidad

Existencias:: No en existencias

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Plazo de entrega de fábrica:: 4 Semanas Tiempo estimado de producción de fábrica.

Introducir cantidad:

Mínimo: 400 Múltiples: 400

Precio unitario:

Precio ext.:

Est. Tarifa:

Precio (CLP)

Cantidad	Precio unitario	Precio ext.
Envase tipo carrete completo (pedir en múltiplos de 400)
	$8.390	$3.356.000
	$7.139	$5.711.200
	$5.239	$10.478.000

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Atributo del producto	Valor de atributo	Seleccionar atributo
Fabricante:	Samtec
Categoría de producto:	Conectores placa a placa y Mezzanine
RoHS:
Serie:	LPAM
Empaquetado:	Reel
Marca:	Samtec
País de ensamblaje:	Not Available
País de difusión:	Not Available
País de origen:	US
Tipo de producto:	Board to Board & Mezzanine Connectors
Cantidad de empaque de fábrica:	400
Subcategoría:	Board to Board & Mezzanine Connectors
Nombre comercial:	LP Array

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Atributos seleccionados: 0

Filtrar documento:

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).